Hardware
assessment.
Lab-grade assessment of silicon, boards, firmware, and secure elements — debug-interface exploitation, side-channel analysis, and fault injection against real devices.
Below the OS. Into the silicon.
When trust boundaries live in silicon, you need a team that works below the OS. We operate in-house hardware labs with tools for die-level analysis, bus probing, side-channel capture, and fault injection — with reviewers who have shipped real exploits against real production devices.
Engagements run from a single secure-boot bypass to a full product assessment spanning silicon through firmware.
From the silicon up.
Die-level analysis, microprobing preparation, bus snooping on JTAG, SWD, SPI, I²C, UART, and PCIe — including debug interface discovery and re-enablement.
Root-of-trust, secure boot, measured boot, fuse state, one-time programmables, and recovery-mode abuse paths.
Binary extraction, decompilation, symbol recovery, code-signing bypass, and exploitation of memory-corruption bugs in C / C++ firmware.
Power analysis (SPA / DPA / CPA), EM analysis, and timing side channels against crypto primitives and secure elements.
Voltage / clock glitching, EMFI, and laser fault injection to bypass secure-boot checks, extract keys, and escape TEEs.
Counterfeit detection, tamper-evidence evaluation, and implant / interdiction risk analysis for critical assets.
Teardown. Extract. Attack. Verify.
Physical Teardown
Non-destructive and destructive teardown, component identification, PCB reverse engineering, and interface mapping.
Interface & Firmware
Debug-port exploitation, firmware extraction, and static + dynamic analysis on the extracted binary.
Active Attack
Side-channel measurement, fault-injection campaigns, and chained exploitation against boot, crypto, and TEE boundaries.
Reporting & Retest
Defensible findings with photographs, traces, captures, and reproducible harness — plus verified retest after mitigations.
What ships.
- 01Teardown photographs and PCB reverse-engineering notes
- 02Debug-interface map (JTAG, SWD, UART, SPI, I²C)
- 03Extracted firmware and decompilation artifacts
- 04Side-channel / fault-injection traces and captures
- 05Exploitation PoCs and reproducible test harness
- 06Verified retest after hardware / firmware mitigations
Silicon. Firmware.
Proven.
Targeted secure-boot review, side-channel study, or full device assessment. Scoped under NDA.